EPO-TEK 353ND-T is a two-component, highly thixotropic epoxy with non-flowing properties and high temperature resistance for semiconductor and HI-REL microelectronic packaging. Manufactured by Epoxy Technology, Inc., it is formulated for vertical and overhead surface bonding where material flow must be prevented after dispensing. It achieves Tg ≥90°C and ≥15 Kg die shear with a <325°C intermittent operating temperature.
Features & Benefits
- Highly thixotropic (TI 3.8) — non-flowing paste stays in place on vertical surfaces
- Tg ≥90°C for reliable performance in high-temperature microelectronic environments
- High die shear ≥15 Kg (5,334 psi) for robust semiconductor die-attach bonds
- High degradation temperature (409°C) for exceptional thermal stability
- Fast cure: 150°C/1 min to 100°C/10 min for production line flexibility
- Service temperature up to 325°C intermittent for demanding HI-REL applications
Typical Applications
- Vertical surface bonding and die attach in HI-REL microelectronic assemblies
- Semiconductor packaging where non-flowing paste is required
- Hybrid circuit assembly and ceramic substrate bonding
- Telecom and datacom opto-electronic device packaging