EPO-TEK OE121 Black is a two-component, black color-coded capillary underfill epoxy for semiconductor flip chip packaging. Manufactured by Epoxy Technology, Inc., it is the black version of EPO-TEK OE121, sharing the same low-viscosity capillary flow, low-temperature cure, and mechanical performance while providing visual identification (black color) during the underfilling process. It is also suitable for adhesive, potting, sealing, and encapsulation in electronics, medical, and optical industries.
Features & Benefits
- Black color enables visual identification and inspection of underfill coverage during production
- Low viscosity (300–500 cPs) enables capillary flow under flip chip bumps without voids
- Low-temperature cure (23–80°C) — safe for heat-sensitive semiconductor packages
- High die shear ≥15 Kg (5,334 psi) for reliable underfill mechanical performance
- Long 5-hour pot life for manual and semi-automated production lines
- Electrically insulating — ≥1 × 10¹³ Ohm-cm volume resistivity
Typical Applications
- Flip chip underfill in semiconductor packages requiring visual process identification
- Underfill of SMDs and BGA packages in electronics assembly
- Potting, sealing, and encapsulation in electronics, medical, and optical industries
- Process-controlled underfill assembly lines using black vs. clear grade differentiation