EPO-TEK 354-T2 is a two-component, thixotropic, high-Tg epoxy designed for semiconductor packaging in medical, fiber optic, and optoelectronic assemblies. Manufactured by Epoxy Technology, Inc., it is the more thixotropic version of EPO-TEK 354-2, with a viscosity of ~20,000 cPs (TI 2.85) to prevent flow on vertical surfaces. It delivers Tg 111°C, die shear ≥20 Kg, and extremely high volume resistivity (≥10¹⁶ Ohm-cm).
Features & Benefits
- Tg 111°C for reliable performance in high-temperature semiconductor and medical environments
- Highly thixotropic (TI 2.85, ~20,000 cPs) — stays in place on vertical surfaces after dispensing
- Exceptional die shear ≥20 Kg (7,112 psi) for very robust semiconductor die bonding
- Ultra-high volume resistivity ≥10¹⁶ Ohm-cm — excellent electrical isolation
- High degradation temperature (430°C) for long-term thermal stability
- Long 3-day pot life for scheduling flexibility in medical device manufacturing
Typical Applications
- Semiconductor packaging in medical devices requiring high Tg and electrical insulation
- Glob-top and die-attach in fiber optic and optoelectronic assemblies
- Thixotropic encapsulation on vertical surfaces in HI-REL electronic packages
- Die bonding in medical and optical industries requiring ≥10¹⁶ Ohm-cm insulation