Product Overview
The Devcon 14250 25ml cartridge is a high-performance, rapid-curing, general-purpose two-part epoxy adhesive and encapsulant. Formulated as a 100% reactive, solvent-free system, Devcon® 5 Minute Fast Drying Epoxy forms a crystal-clear, rigid, and exceptionally strong bond in just minutes.
The compact Devcon 14250 25ml cartridge configuration is engineered for precise, small-scale industrial maintenance, quick metal-to-metal repairs, and electronic component encapsulation, ensuring an exact 1:1 automatic mix ratio with minimal waste.
Key Features & Benefits
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Rapid Fixation: Features a 4-minute working time (28gm @ 24°C) and a fast 7-minute fixture time, reaching a functional cure in only 45 minutes.
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Multi-Material Versatility: Delivers high-strength structural bonding on metals, fabrics, ceramics, glass, wood, and concrete (including complex material combinations).
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Industrial Grade Protection: Acts as an excellent potting compound for micro-electronics, sealing perfectly against dust, dirt, and harsh environmental conditions.
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Resilient Formulation: 100% solids by volume with zero solvents, ensuring minimal shrinkage, superior dielectric strength (490 volts/mil), and robust solvent resistance.
Intended Applications
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Fast curing, thin-set structural metal-to-metal bonding and emergency repairs.
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Potting and encapsulating micro-electronics, sensors, and terminal blocks.
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Sealing industrial assemblies against dust, dirt, and chemical combinations.