EPO-TEK OG198-55 is a single-component, high-viscosity, thixotropic shadow-curable UV epoxy — the more thixotropic version of EPO-TEK OG198-54. Manufactured by Epoxy Technology, Inc., its high thixotropic index (6.0) prevents flow on vertical surfaces after dispensing, while its shadow-cure capability ensures polymerization in UV-blocked areas. It achieves Tg ≥120°C and 27.7 Kg die shear after UV + RT cure.
Features & Benefits
- Shadow cure + high thixotropy (TI 6.0) — stays in place on vertical surfaces and cures in UV shadows
- Highest Tg in OG198 series: ≥120°C for demanding thermal environments
- Die shear UV only: ≥20 Kg (7,112 psi) — immediate high fixture strength
- Final die shear 27.7 Kg (9,850 psi) after UV + RT cure
- Excellent transmission ≥97% @ 560–1,680 nm for visible to near-IR applications
- Thermal post-cure beneficial for maximizing properties
Typical Applications
- Vertical and overhead optical component bonding requiring shadow cure and non-flow behavior
- Fiber optic assembly with complex geometry where UV shadows are unavoidable
- Semiconductor die encapsulation requiring high-Tg UV-cure thixotropic paste
- Photonic packaging requiring combined UV shadow cure and high temperature performance
