EPO-TEK OE138 is a two-component epoxy with intermediate viscosity between EPO-TEK 353ND and 353ND-T, designed for semiconductor glob-top applications and the medical and fiber optic industries. Manufactured by Epoxy Technology, Inc., it delivers an exceptional die shear of ≥20 Kg and a very low CTE below Tg (21 × 10⁻⁶ in/in°C) — minimizing thermomechanical stress on bond wires and delicate optical components.
Features & Benefits
- Intermediate viscosity (4,000–7,000 cPs) — fills the gap between 353ND and 353ND-T
- Very low CTE below Tg (21 × 10⁻⁶ in/in°C) — minimal thermal stress on bond wires and chips
- Exceptional die shear ≥20 Kg (7,112 psi) for robust glob-top bonding
- Tg ≥90°C for stable performance in high-temperature environments
- High degradation temperature (406°C) for long-term thermal stability
- Fast cure option: 150°C / 2 minutes for high-throughput production lines
Typical Applications
- Semiconductor glob-top protection of wire-bonded chips in electronic packages
- Fiber optic component bonding and encapsulation in photonic assemblies
- Medical device packaging requiring low-stress, biocompatible-compatible epoxy
- Die attach and encapsulation in HI-REL and optoelectronic applications