EPO-TEK 353NDP is a two-component high-temperature and high-humidity resistance epoxy for optical, telecom, datacom, and HI-REL microelectronic packaging. Manufactured by Epoxy Technology, Inc., it retains 15 Kg die shear after 2,000 hours at 85°C/85%RH — demonstrating exceptional long-term humidity resistance. Available as a single-component frozen syringe for automated dispensing.
Features & Benefits
- Exceptional humidity resistance: 15 Kg die shear retained after 2,000 hrs at 85°C/85%RH
- High initial die shear of 38 Kg for maximum bond strength in critical semiconductor packages
- Tg ≥90°C for stable performance in high-temperature environments
- Multiple fast-cure options: 150°C/1 min to 80°C/30 min for production flexibility
- High degradation temperature (410°C) for long-term thermal stability
- Available as single-component frozen syringe for automated production lines
Typical Applications
- Die attach in HI-REL microelectronics requiring long-term humidity resistance
- Optical component bonding in telecom and datacom modules
- Semiconductor packaging subject to 85°C/85%RH reliability testing
- Hybrid circuit assembly in military and aerospace electronics