EPO-TEK OG198-54 is a single-component, low-viscosity shadow-curable UV epoxy that is electrically and thermally insulating. Manufactured by Epoxy Technology, Inc., its shadow-cure capability allows it to cure in areas not directly exposed to UV — critical for complex optical assemblies with hidden bond lines. It delivers ≥97% transmission at 460–1,680 nm and Tg ≥115°C after full cure.
Features & Benefits
- Shadow cure capability — cures in UV-unexposed areas for complex optical assemblies
- Low viscosity (200–450 cPs) for precise, bubble-free dispensing in optical packages
- Excellent optical clarity ≥97% transmission @ 460–1,680 nm
- Electrically and thermally insulating — safe for sensitive electronic environments
- High Tg ≥115°C for solder reflow and high-temperature service
- Die shear 20.8–22.2 Kg after UV + post-cure for reliable structural bonds
Typical Applications
- Optical component bonding with shadow areas not reachable by direct UV irradiation
- Fiber optic and waveguide bonding in photonic packaging
- Lens attachment and encapsulation requiring low viscosity and shadow cure
- Die encapsulation in optoelectronic assemblies requiring UV and thermal stability
