SILCOOL TIA208R-HF is the highly flowable version of SILCOOL TIA208R from Momentive Performance Materials. Its lower mixed viscosity (2,000 mPa·s) enables superior flow into complex cavities and narrow gaps. Delivers primerless adhesion, UL94 V-0 flame retardancy, and -40°C to 150°C operating range.
Features & Benefits
- Highly flowable (2,000 mPa·s mixed) — superior penetration into complex cavities and narrow gaps
- Primerless adhesion to metals and plastics for simplified production
- UL94 V-0 equivalent flame retardancy for electronic potting applications
- RT and heat-accelerated cure (70°C × 0.5 hrs) options
- Excellent electrical insulation: 25 kV/mm dielectric strength
- Continuous operating range -40°C to 150°C
Typical Applications
- Potting of power electronics with complex geometries requiring superior cavity fill
- Gap filling in tight spaces within LED drivers and ballasts
- Thermal potting of automotive ECUs requiring superior void-free filling
- Encapsulation where standard-viscosity TIA208R cannot reach narrow cavities
