SILCOOL TIA216G is a 2-component, thermally conductive potting material used primarily on complex thermal interface designs. Its low viscosity allows it conform to intricate shapes, and thus enable the reduction of contact interference. SILCOOL TIA216G potting material quickly cures to a soft rubber, gel consistency with exposure to heat, and retains tacky adhesion on its cured surface.
FEATURES AND BENEFITS:
- Good thermal conductivity
- Low viscosity
- Fast cure with exposure to heat
- Room temperature cure capability
- Easy to use 1 : 1 mix ratio by weight and volume
- Repairability
- Non-corrosiveness to metal
- UL 94V-0 Compliance (file number E56745)