EPO-TEK H70E-2 is a two-component thermally conductive, electrically insulating epoxy for glob-top chip protection in TAB and COB die-attach technologies. Manufactured by Epoxy Technology, Inc., it prevents mechanical damage to chips during micro-package assembly while dissipating heat. Its very low CTE below Tg (20 × 10⁻⁶) minimizes thermal stress on bond wires, and its degradation temperature of 447°C is among the highest in the EPO-TEK range.
Features & Benefits
- Thermally conductive and electrically insulating — dual-function glob-top material
- Very low CTE below Tg (20 × 10⁻⁶ in/in°C) — minimal thermal stress on bond wires
- Exceptional degradation temperature (447°C) — highest thermal stability in EPO-TEK range
- Tg ≥80°C for stable performance in PCB soldering environments
- Flexible Shore D65 — accommodates thermal expansion without delamination
- Long pot life (2 days) and fast-cure options (80°C/90 min to 175°C/1 min)
Typical Applications
- Glob-top protection of bare chips in COB (Chip-on-Board) assemblies
- Chip protection in TAB (Tape Automated Bonding) micro-package technologies
- Encapsulation of bond-wire-connected chips in consumer electronics
- Thermally conductive chip protection in LED and optoelectronic modules