EPO-TEK T7110 is a two-component thermally conductive, electrically insulating epoxy designed for heat-sinking electronics and semiconductors. Manufactured by Epoxy Technology, Inc., it delivers 1.0 W/mK thermal conductivity and can cure at room temperature (23°C / 3 days) — making it suitable for heat-sensitive assemblies that cannot withstand elevated cure temperatures. It is used as an adhesive, potting, or encapsulation material in consumer electronics and optics.
Features & Benefits
- Room-temperature cure option (23°C / 3 days) — suitable for heat-sensitive assemblies
- 1.0 W/mK thermal conductivity for effective heat dissipation from electronics to heat sinks
- Electrically insulating (≥2 × 10¹³ Ohm-cm) — no short-circuit risk in bonded assemblies
- Very high Shore D hardness (91) for rigid, durable bonded joints
- Low CTE below Tg (31 × 10⁻⁶ in/in°C) for reduced thermal stress
- Versatile material: usable as adhesive, potting, or encapsulant
Typical Applications
- Heat-sinking of electronics and semiconductors in consumer products
- Thermally conductive bonding in optical and optoelectronic assemblies
- Potting and encapsulation of electronic components requiring thermal management
- Heat dissipation bonding in applications where elevated cure temperature is not possible