SILCOOL TIA219R and TIA219RP are two-component thermally conductive silicone potting materials from Momentive Performance Materials delivering 1.9 W/mK with primerless adhesion to metals, plastics, glass, and ceramics. TIA219RP offers a 10-hour extended work life for large-batch operations versus the standard 30-minute work life of TIA219R.
Features & Benefits
- 1.9 W/mK thermal conductivity for effective heat dissipation in potted electronic assemblies
- Primerless adhesion to metals, plastics, glass, and ceramics — no primer process step
- TIA219RP extended pot life (10 hrs) for large-batch and slow-fill operations
- Outstanding stress relief with soft Shore A25 rubber after cure
- UL94 V-0 equivalent and low volatile (200 ppm D3-D10)
- Room temperature or heat-accelerated cure (70°C × 30 min)
Typical Applications
- Thermal potting of power electronics modules and converters
- Potting of LED drivers and lighting control electronics
- Gap filling in automotive and industrial electronics requiring primerless adhesion
- Thermal path creation in telecommunications equipment and base station electronics