SILCOOL TIA225GFB-25 is a two-component black liquid-dispensed silicone thermal pad from Momentive with integrated 250 µm glass beads for precise bond line thickness control. Black version of TIA225GF delivering 2.5 W/mK with repeatable BLT for consistent thermal performance in high-volume production.
Features & Benefits
- 250 µm glass beads — precise bond line thickness control for consistent thermal resistance
- 2.5 W/mK thermal conductivity as a liquid-dispensed pre-fabricated thermal pad alternative
- Black color enables visual inspection of dispensing coverage in production
- Low volatile siloxane (150 ppm) for sensitive electronic environments
- UL94 V-0 equivalent and RTI 150°C for flame-retardant electronic applications
- Repairable — can be removed and re-applied for rework operations
Typical Applications
- Liquid-dispensed thermal pad with controlled 250 µm BLT in automotive electronics
- Applications requiring repeatable BLT for consistent thermal resistance
- Gap filling in consumer and telecom electronics where BLT uniformity is critical
- High-volume automated thermal pad deposition requiring controlled bond line thickness