SILCOOL TIA241GF is a two-component soft liquid-dispensed silicone gap filler from Momentive delivering 4.1 W/mK and UL94 V-0 certification (File No. E56745). Excellent slump resistance and glass bead options (180 µm, 250 µm) for BLT control. Fast cure: 100°C × 15 min.
Features & Benefits
- 4.1 W/mK high thermal conductivity — high-performance liquid-dispensed gap filler
- UL94 V-0 certified (File No. E56745) for reliable flame retardant performance
- Excellent slump resistance (TI 2.6) — stays in place after dispensing
- Glass bead options (180 µm, 250 µm) for precise BLT control upon request
- Repairable — can be removed and re-applied for rework operations
- Fast cure: 100°C × 15 min or 70°C × 30 min for high-throughput production
Typical Applications
- High-conductivity thermal interface in automotive power electronics modules
- Gap filling in telecommunications equipment requiring 4.1 W/mK performance
- Thermal interface in consumer electronics power management ICs
- Liquid-dispensed thermal pad replacement in lighting and industrial applications
