SILCOOL TIA251GF
Momentive

SILCOOL TIA251GF

Two-component soft liquid-dispensed gap filler, 5.1 W/mK, 220 Pa·s, TI 2.6, Shore E45, thermal resistance 30 mm²·K/W at 80 µm BLT, UL94 V-0 certified (File No. E56745), glass bead options for BLT control.

Product code: TIA251G
Package size: 25kg pail A+B
Shelf Life: Contact for more details

SILCOOL TIA251GF is a two-component soft liquid-dispensed silicone gap filler from Momentive delivering 5.1 W/mK and UL94 V-0 certification (File No. E56745). Excellent slump resistance and glass bead options (180 µm, 250 µm) for BLT control. Fast cure: 100°C × 15 min.

Features & Benefits

  • 5.1 W/mK high thermal conductivity — high-performance liquid-dispensed gap filler
  • UL94 V-0 certified (File No. E56745) for reliable flame retardant performance
  • Excellent slump resistance (TI 2.6) — stays in place after dispensing
  • Glass bead options (180 µm, 250 µm) for precise BLT control upon request
  • Repairable — can be removed and re-applied for rework operations
  • Fast cure: 100°C × 15 min or 70°C × 30 min for high-throughput production

Typical Applications

  • High-conductivity thermal interface in automotive power electronics modules
  • Gap filling in telecommunications equipment requiring 5.1 W/mK performance
  • Thermal interface in consumer electronics power management ICs
  • Liquid-dispensed thermal pad replacement in lighting and industrial applications
Property Value Test Method / Condition
Appearance Part A/B Blue / Pale Blue Visual
Dispensability A/B 25 (A)/25 (B) g/min
Mix Ratio 1 : 1
Viscosity (mixed) 220 Pa·s
Thixo Index 2.6
Work Life @ 23°C 1.5 hrs
Cure @ 100°C 15 min
Cure @ 70°C 30 min
Cure @ 23°C 24 hrs
Density 3.2 g/cm³ 23°C
Thermal Conductivity 5.1 W/mK Hot wire
Thermal Resistance @ 80 µm BLT 30 mm²·K/W In-house
Hardness Type E 50
Tensile Strength 0.2 MPa
Elongation 40%
Volume Resistivity 4.5×10^14 MΩ·m
Dielectric Strength 14 kV/mm
CTE 110 ppm/°C
Low Volatile D4-D10 150 ppm
Flame Retardancy UL94 V-0 (equivalent)

No documents available yet. Contact us to request the technical data sheet.

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