SILCOOL TIA2101GF is the two-component flagship of the SILCOOL liquid-dispensed series from Momentive, delivering an exceptional 10.2 W/mK. Its ultra-soft cured body (Shore E10) achieves minimum BLT of 140 µm at 100N (or 73 µm at 1,500N) with <100 ppm D4-D10 for the most demanding siloxane-sensitive environments.
Features & Benefits
- 10.2 W/mK ultra-high thermal conductivity — flagship grade in SILCOOL liquid-dispensed range
- Ultra-soft Shore E10 — minimum pressure needed to achieve thin BLT
- BLT range: 140 µm at 100N to 73 µm at 1,500N for design flexibility
- Ultra-low volatile siloxane <100 ppm D4-D10 for most demanding clean environments
- Thermal resistance 17 mm²·K/W at 140 µm BLT
- Repairable and kit-matched (A+B from same batch) for production control
Typical Applications
- Ultra-high-performance thermal interface for SiC and GaN power semiconductors in EV powertrains
- Die-to-heat-spreader thermal management in high-power microprocessors and GPUs
- Thermal pad replacement in advanced IGBT power modules for industrial drives
- High-power RF and base station power amplifier thermal management